Leveraging cov kev ua tau zoo tiering muaj peev xwm ntawm ST chips, Hunan Leading Technology tau pib ob qho kev sib txawv ntawm cov tswj kom ua tau raws li cov neeg siv khoom siv ntau yam xwm txheej:
1. SL-T21&22/T/Q Cost-Effective Version
Nruab nrog nruab nrab zaus STM32 chips thiab ST Purple Ming Platform V13.0, tus qauv no muab tag nrho cov kev tswj hwm kev txawj ntse, suav nrog kev hloov kho cov kua dej meej, ntau txheej twj tso kua mis tiv thaiv, thiab lub tswb nrov hauv zos. Nws yog qhov zoo tagnrho rau ib lub twj tso kua mis nqa cov khoom siv hauv tsev villa hauv qab daus, cov chav tsev me me, thiab cov khw me me - muab cov nqi tsim nyog thiab kev xaiv zoo.
2. SL31&32/F/Q Flagship IoT Version
Featuring high-performance 800MHz STM32 main control chips with hardware acceleration units and the upgraded ST Purple Ming Platform V14.0, this version supports dual-pump alternation, variable frequency speed regulation, cloud remote connection, and multi-device cluster management. Nws yog qhov tsim nyog rau cov chaw lag luam loj, chav ua noj hauv tsev so, ntau lub tsev twj tso kua mis hauv cov chaw nres tsheb hauv av, thiab cov chaw ua haujlwm me me hauv nroog cov dej phwj tuaj nqa - ua tau raws li cov kev xav tau ntawm kev tswj xyuas cov kev xav tau ntawm engineering engineering.
Ob qho qauv qhia tib yam hauv qab ST chip architecture kom ntseeg tau cov qauv kev ruaj ntseg zoo ib yam. Txawm hais tias siv rau tsev neeg tseem ceeb lossis kev txhawb nqa loj hauv kev lag luam engineering, lawv xa cov khoom sib xws thiab kev ntseeg siab tswj kev ua tau zoo. Peb muab ib-nres semiconductor ntse tswj kev daws teeb meem rau cov kav dej lifting khoom manufacturers, engineering muab kev pab, thiab cov neeg siv kawg.
